TongFu Microelectronics Co Ltd
- Industria
- AI Advanced Packaging
- Bolsa
- Shenzhen
- País / Región
- China
- Fecha de salida a bolsa
- 16 de agosto de 2007
- Empleados
- 25.446
- Sitio web
- www.tfme.com
Rango de valoración compuesto · conservador ¥28–¥36 / razonable ¥42–¥55 / optimista ¥70–¥90. A ¥68.27, Entre el rango razonable y el optimista.
Al publicar ¥60.1 (11 de junio de 2026)
Aún no hay análisis sobre este valor en tu idioma.
Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) encapsulation test services in China and internationally. The company offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband, memory devices, LCD driver devices, SiP devices, and power module devices; and specific application integrated circuits that includes CPU, GPU, gaming console and high performance networking products. It serves communication, mobile terminals, household appliances, AI, auto electronics, and other sectors. The company was formerly known as Nantong Fujitsu Microelectronics Co., Ltd. and changed its name to Tongfu Microelectronics Co.,Ltd in December 2016. Tongfu Microelectronics Co.,Ltd was founded in 1994 and is headquartered in Nantong, China.
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