TongFu Microelectronics Co Ltd
- Indústria
- AI Advanced Packaging
- Bolsa
- Shenzhen
- País / Região
- China
- Data do IPO
- 16 de agosto de 2007
- Funcionários
- 25.446
- Site
- www.tfme.com
Faixa de valuation composta · conservador ¥28–¥36 / justo ¥42–¥55 / otimista ¥70–¥90. A ¥68.27, Entre as faixas justa e otimista.
Na publicação ¥60.1 (11 de junho de 2026)
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Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) encapsulation test services in China and internationally. The company offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband, memory devices, LCD driver devices, SiP devices, and power module devices; and specific application integrated circuits that includes CPU, GPU, gaming console and high performance networking products. It serves communication, mobile terminals, household appliances, AI, auto electronics, and other sectors. The company was formerly known as Nantong Fujitsu Microelectronics Co., Ltd. and changed its name to Tongfu Microelectronics Co.,Ltd in December 2016. Tongfu Microelectronics Co.,Ltd was founded in 1994 and is headquartered in Nantong, China.
Dados da EODHD, apresentados na moeda de reporte; apenas para referência, não constitui recomendação de investimento.
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