Company Profile · Technology

TongFu Microelectronics Co Ltd

002156 · Shenzhen
Exchange
Shenzhen
Country
China
IPO date
Aug 16, 2007
Employees
25,446
Current Price
¥68.27
Live · Jun 18, 2026
Fair Buy
≤ ¥36
Margin-of-safety entry
Baillie Growth Score
40/100
Weak
Intrinsic Value · Three-Tier Range Current price ¥68.27 Live · Between the fair and optimistic ranges

Composite valuation range · conservative ¥28–¥36 / fair ¥42–¥55 / optimistic ¥70–¥90. At ¥68.27, Between the fair and optimistic ranges.

At publication ¥60.1 (Jun 11, 2026)

Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) encapsulation test services in China and internationally. The company offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband, memory devices, LCD driver devices, SiP devices, and power module devices; and specific application integrated circuits that includes CPU, GPU, gaming console and high performance networking products. It serves communication, mobile terminals, household appliances, AI, auto electronics, and other sectors. The company was formerly known as Nantong Fujitsu Microelectronics Co., Ltd. and changed its name to Tongfu Microelectronics Co.,Ltd in December 2016. Tongfu Microelectronics Co.,Ltd was founded in 1994 and is headquartered in Nantong, China.

Market capCN¥103.61B
Revenue (TTM)CN¥29.31B
EBITDACN¥5.35B
Profit margin4.94%
ROE9.67%
P/E (TTM)71.86
Forward P/E30.21
PEG0
EPSCN¥0.95
Dividend yield0.12%
52-week rangeCN¥23.25 – CN¥78.47

Data from EODHD, shown in the reporting currency; for reference only, not investment advice.

History

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Industry position

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