Perfil da empresa · Technology

Acm Research Inc

ACMR · EUA
Bolsa
EUA
País / Região
USA
Data do IPO
3 de novembro de 2017
Funcionários
2.513
Preço atual
$109.87
Ao vivo · 22 de junho de 2026
Compra justa
≤ $88
Entrada com margem de segurança
Pontuação de Crescimento Baillie
49/100
Fraco
Valor intrínseco · Faixa em três níveis Preço atual $109.87 Ao vivo · Dentro da faixa de valor intrínseco justo

Faixa de valuation composta · conservador $78–$88 / justo $104–$140 / otimista $171–$190. A $109.87, Dentro da faixa de valor intrínseco justo.

Na publicação $104.5 (28 de junho de 2026)

Valor de mercadoUS$ 7,25 bi
Receita (TTM)US$ 960,23 mi
EBITDAUS$ 138,61 mi
Margem líquida9,48%
ROE7,6%
P/L (TTM)80,09
P/L projetado63,29
LPAUS$ 1,31
Faixa de 52 semanasUS$ 23,03 – US$ 111,41
Preço-alvo dos analistasUS$ 94,34
Recomendação dos analistas4.3 / 5

Dados da EODHD, apresentados na moeda de reporte; apenas para referência, não constitui recomendação de investimento.

ACM Research, Inc., together with its subsidiaries, develops, manufactures, and sells capital equipment in Mainland China and internationally. It also develops, manufactures, and sells a range of packaging tools to wafer assembly and packaging customers. The company provides wet cleaning equipment for front end production processes; electrochemical plating, furnace, PECVD, and track platforms; Space Alternated Phase Shift, technology for flat and wafer surfaces; timely energized bubble oscillation, technology for patterned wafer surfaces at advanced process nodes; and Tahoe technology; and semi-critical cleaning tools. It also offers advanced packaging equipment, such as coaters, developers, photoresist strippers, scrubbers, wet etchers and copper-plating equipment; and advanced packaging products include: Ultra ECP ap, which delivers a uniform metal layer to finished wafers prior to packaging; Ultra C Developer, which applies liquid developer to selected parts of photoresist to resolve an image; Ultra C PR Megasonic-Assisted Stripper, which removes photoresist; Ultra C Scrubber, which scrubs and cleans wafers; Ultra C Thin Wafer Scrubber, which addresses a sub-market of cleaning very thin wafers for certain Asian assembly factories; and Ultra C Wet Etcher, which etches silicon wafers and copper and titanium interconnects. In addition, the company provides ECP technology for advanced metal plating; Ultra fn Furnace, a dry processing tool; Ultra Pmax PECVD tools, a proprietary designed chamber, gas distribution unit, and chuck; and Ultra Track, a 300mm process tool that delivers uniform air downflow, fast robot handling and configurable software to address specific customer requirements. It markets and sells its products under the SAPS, TEBO, ULTRA C, ULTRA Fn, Ultra ECP, Ultra ECP map, and Ultra ECP ap trademarks through direct sales force and third-party representatives. ACM Research, Inc. was incorporated in 1998 and is headquartered in Fremont, California.

História

Em breveEsta seção está sendo preenchida — volte em breve.

Posição no setor

Em breveEsta seção está sendo preenchida — volte em breve.

Ainda não há análises sobre este ativo no seu idioma.