Shengyi Technology Co Ltd
- Industrie
- Electronic Materials
- Bourse
- Shanghai
- Pays / Région
- China
- Date d'introduction en bourse
- 16 septembre 1998
- Effectif
- 14 523
- Site web
- www.syst.com.cn
Fourchette de valorisation composite · prudent ¥15–¥20 / raisonnable ¥25–¥35 / optimiste ¥50–¥70. À ¥183.87, Au-dessus du plafond optimiste · croissance future déjà escomptée.
À la publication ¥145 (9 juin 2026)
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Shengyi Technology Co.,Ltd. engages in the design, production, and sales of copper clad laminates, bonding sheets, and printed circuit boards in China and internationally. The company offers flame-retardant epoxy glass fabric reinforced laminates, composite epoxy materials, and flexible circuit materials, as well as prereg for multilayer circuit boards; and smart and rigid materials, automotive and RF materials, IMS and HTC materials, IC substrate and flexible materials, HSD materials, and special materials. It also provides high-end electronic materials, such as prepregs, insulating laminates, metal-based copper clad foil laminates, resin-coated copper foil, and covering films. The company's products are primarily used in high computing power, AI servers, 5G antennas, base stations, computers, servers, the aerospace industry, chip packaging, automotive electronics, smart homes, industrial control medical equipment, home appliances, consumer terminals, and various electronic products. It also exports its products to America, Europe, Korea, Japan, and Southeast Asia. The company was formerly known as Guangdong Shengyi Sci. Tech Co., Ltd. Shengyi Technology Co.,Ltd. was founded in 1985 and is headquartered in Dongguan, China.
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Historique
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Position dans le secteur
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