6146

Disco is Japan's leading back-end semiconductor equipment maker, specializing in the three high-precision, mission-critical steps of wafer dicing, grinding, and polishing, with an integrated equipment-plus-consumables-plus-service model that benefits deeply from AI/HBM and advanced packaging demand. FY2025 net profit was roughly 135.5 billion yen, overseas sales made up 87.6% of the total, the balance sheet carries long-term net cash, gross margins are exceptionally high, and management runs the business against a four-year RORA discipline. Rating Watch: a superb business whose current price already prepays years of high-growth, high-margin, AI-driven expectations, leaving little margin of safety.